3:1 aspect ratio grid results in higher yield in Mass Spectrometer process

Ultra-fine metal mesh specialist, Stork Veco, has managed to improve it’s electroforming process even further. A 3:1 aspect ratio and high open area grid, results in a higher yield in TOF-Mass Spectrometer processes.

A method for the production of meshes or grids with a higher aspect ratio was developed by Stork Veco, a Netherlands-based electroforming and photo etching company. A special photo-resist combined with a specially adopted electroforming process has resulted is this high aspect ratio grid with superb quality.

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The meshes or grids used in the time of flight (TOF) mass spectrometers need to be rigid and would ideally have an maximized open area of 90% or more. Traditional meshes can cause issues such as easy breaking of the mesh, restricted open area and a non-uniform slit pattern. All these problems are solved at once with the electroformed high aspect ratio mesh.

The Stork Veco grid is created from pure hard nickel which can withstand vibration and avoids unwanted material stress. With the new photo resist, Stork Veco managed to produce prototypes with an aspect ratio of 3:1 (the thickness of the grid compared with the bar/aperture size). This means 20 micron bars in a 60 micron thick mesh, resulting in a more rigid product with an optional higher open area. The uniform and highly consistent slit pattern can have an open area up to 90% ; this may even be increased. Besides the rigidity and preciseness of the grid, flatness is also an important advantage of this technology.

Stork Veco now can offer grids and meshes for manufacturers of time-of-flight mass spectrometers, cathode ray tubes and similar instruments. Of course, this new combination of photo-resist and electroforming can also be used for other precision parts in for example the analysis, electronics or medical industry. The company can produce prototype, low- and high-volume micro-parts with features down to a few microns, with sub-micron accuracy. Parts can have multi-level profiles with high aspect ratios and may consist of different kinds of nickel and several types of coatings are available.

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